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Title:
SURFACE MOUNTING SEMICONDUCTOR ELECTRONIC PART AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP3876250
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a method for manufacturing a surface mounting semiconductor electronic part having an electrode which ensures soldering to a mount board, and to provide the surface mounting semiconductor electronic part manufactured using the method.
SOLUTION: Conductive patterns 3 which are disposed on both surfaces of an insulating substrate 2 are electrically connected via through holes each formed with a metal conductive film 4 formed in the inner peripheral surface thereof. Then, an opening of each through hole is covered with two layers 6, 7 of resist with the resist filled to the midway of the through hole, to form a double-sided through hole printed board. An LED bare chip 10 and a light receiving bare chip 11 are fixed to respective conductive patterns 3 connected to the through holes so as to allow electrical connection between each of the bare chips 10, 11 and its lower electrode. An upper electrode of each of the bare chips is electrically connected via a wire 12 to the conductive pattern 3 connected to a through hole 5 which is isolated from the conductive patterns 3 where the bare chips are disposed. The individual bare chips and wires are covered with optically transparent resins for sealing.


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Inventors:
Kozo Tanaka
Kan Nakajima
Application Number:
JP2003404753A
Publication Date:
January 31, 2007
Filing Date:
December 03, 2003
Export Citation:
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Assignee:
Stanley Electric Co., Ltd.
International Classes:
H01L21/56; H01L31/02; H01L33/56; H01L33/58; H01L33/62; (IPC1-7): H01L21/56; H01L31/02; H01L33/00
Domestic Patent References:
JP2003008077A
JP10135492A
JP2001148506A
Attorney, Agent or Firm:
Teruo Akimoto



 
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