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Title:
SURFACE PACKAGING TYPE DIELECTRIC RESONATOR AND MANUFACTURE OF THE SAME
Document Type and Number:
Japanese Patent JPH0685517
Kind Code:
A
Abstract:

PURPOSE: To provide a surface mounting dielectric resonator and the manufacturing method of the same so as to perform soldering while hardly dispersing the fitting position of a connecting terminal and stablizing the strength of joining.

CONSTITUTION: This resonator is a surface packaging type dielectric resonator 1 provided with a connecting terminal 4 on an inner conductor 8 of an open end face. Concerning the resonator 1, a conductive member composed of a flat part 10, locking part 11 and ground terminal part 12 is provided on an outer conductor 9 on the bottom of a dielectric resonator 2, and the ground terminal part 12 and the connecting terminal 4 are positioned on the same plane. Concerning the manufacture, the ground terminal part 12 and the connecting terminal 4 are joined to the practically same lead frame 25 by soldering while loading the resonator 2 and disconnected from the lead frame 25.


Inventors:
KUROKI HIROSHI
NISHIGORI MASATO
Application Number:
JP23211692A
Publication Date:
March 25, 1994
Filing Date:
August 31, 1992
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H01P7/04; H01P11/00; (IPC1-7): H01P7/04; H01P11/00