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Title:
SURFACE PLATE CORRECTING CARRIER OF LAPPING MACHINE FOR WAFER
Document Type and Number:
Japanese Patent JPH09193002
Kind Code:
A
Abstract:

To abolish supply of polishing liquid by forming a surface plate correcting carrier so that abrasive grains are fixedly secured on the surface of a base plate made of highly hard material.

Abrasive grains 22 are electrical-meltingly fixed on the surfaces of both sides of a ring-like base plate 21 made of highly hard material, and the abrasive grains 22 are directly contacted with the surfaces of an upper surface plate 11 and a lower surface plate 12. A ring gear Gr is engaged with a sun gear Gs and an internal gear Gi, and a planetary gear mechanism G is constituted as a whole. By operating this planetary gear mechanism G, a surface plate correcting carrier 20 is revolved while autorotating between upper and lower both surface plates 11, 12, and the surfaces of the upper surface plate 11 and the lower surface plate 12 are polished and corrected. Hereby, supply of polishing liquid which is a big factor generating lack of uniformity of the surface configuration on the surface plates 11, 12, can be abolished, and the surface configuration of the surface plates 11, 12 can be corrected by the surface plate correcting carrier 20 itself.


Inventors:
YOSHIDA YUICHI
TAKAGI MASAHARU
Application Number:
JP350396A
Publication Date:
July 29, 1997
Filing Date:
January 12, 1996
Export Citation:
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Assignee:
NIPPON STEEL CORP
International Classes:
B24B53/017; H01L21/304; (IPC1-7): B24B37/00; H01L21/304
Attorney, Agent or Firm:
Mikio Hatta (1 outside)



 
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