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Patent Searching and Data


Title:
SURFACE POLISHING METHOD
Document Type and Number:
Japanese Patent JPH03161268
Kind Code:
A
Abstract:

PURPOSE: To enable a continuous running while maintaining quality for a long time with the execution of the surface polishing of a wire rod or bar rod, by performing the reciprocation of a cylinder which runs a clay like abrasive grain under pressure, in the material feeding direction.

CONSTITUTION: A wire rod or bar rod 1 is set to a wound part 4, wound on a roller of a tension part 5 further, passed through a movable cylinder 9 and wound on the roller of a winding tension part 6. Thereafter, the tip of the wire rod or bar rod is fixed to the bobbin of a take-up part 7. After filling a viscoelastic abrasive 3 in a pressure cylinder 10, this abrasive 3 is pressurized at a pressure part 8, pressure-fed to the movable cylinder 9 and the viscoelastic abrasive 3 is repeatedly moved to the right and left pressure cylinders 10. The movable cylinder 9 is reciprocated in this state and the wire rod or bar rod 1 rewound at constant speed by the driving of the take-up part 7 is polished by this abrasive 3.


Inventors:
SATO TAKASHI
Application Number:
JP29673989A
Publication Date:
July 11, 1991
Filing Date:
November 15, 1989
Export Citation:
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Assignee:
SEIKO ELECTRONIC COMPONENTS
International Classes:
B24B31/116; (IPC1-7): B24B31/116
Attorney, Agent or Firm:
Keinosuke Hayashi