To provide a surface processing device capable of applying hairline processing to a curved surface evenly, a surface processing method capable of applying the hairline processing to the curved surface evenly, and a surface processed body wherein the hairline is applied to the curved surface formed beforehand.
A polishing surface 24 having a recessed surface along a projection surface of a surface 51 to be processed is rotated and moved so as to come in pressure contact with the surface 51 to be processed in an elastic force of a buffer part 23. Accordingly, the recessed surface of the polishing surface 24 is in contact with the projection surface of the surface 51 to be processed evenly, and the hairline processing with no unevenness can be performed. The surface processed body 50 having the surface 51 to be processed comprises a material such as metal or plastic. The surface processed body 50 of a metal material is manufactured by casting, pressing, powder metallurgy, forging, or the like. Furthermore, the surface processed body 50 of a plastic material is manufactured by injection molding.
KURAMOTO MAKOTO
HASHIGUCHI TADASHI
