Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
電磁エネルギーの表面保護
Document Type and Number:
Japanese Patent JP6541935
Kind Code:
B2
Abstract:
An electromagnetic energy protection system for an aircraft component, the system including a plurality of conductive sheets (208A, 208B, 208C, 208D, 208E) ohmically connected by conductive interconnects (210A, 210B). The conductive interconnects are metal formed by a metal deposition process. The metal deposition process can include a plasma deposition process. The conductive interconnects prevent the formation of surface deformities such as bumps that may be caused when connecting, either physically or electrically, adjacent conductive sheets.

Inventors:
Burgess, Robert Marshall
Marshall, Joseph A.
Application Number:
JP2014050401A
Publication Date:
July 10, 2019
Filing Date:
March 13, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
The Boeing Company
International Classes:
B64D45/02; B32B5/02; B64C1/00
Domestic Patent References:
JP2225200A
JP2011524265A
JP2010540345A
Foreign References:
US20080144249
US20090001217
WO2012159608A2
Attorney, Agent or Firm:
Sonoda Yoshitaka
Kobayashi Yoshinori