Title:
プリフォームはんだとともに使用される表面反応性の保護剤
Document Type and Number:
Japanese Patent JP2007508938
Kind Code:
A
Abstract:
A composition that reacts with and preserves the metal surface of a solder preform and the preserved solder preform are described. The surface preservative composition is compatible with the physical handling of solder performs and the requirements of the soldering process. The composition comprises a carrier, a surface reactive agent, an anti-static agent and a solvent.
Inventors:
Gregory Sea Meunier
Application Number:
JP2006534091A
Publication Date:
April 12, 2007
Filing Date:
September 30, 2004
Export Citation:
Assignee:
KAC Holdings, Inc.
International Classes:
B23K35/14; B23K35/02; B23K35/26; B23K35/363; C09D5/00; C09K3/00; C23C22/02; B23K35/36; C22C11/06; C22C12/00; C22C13/00; H05K3/28; H05K3/34; C23C
Attorney, Agent or Firm:
Kosaku Sugimura
Shiro Fujitani
Kiyoshi Kuruma
Tatsuya Sawada
Shiro Fujitani
Kiyoshi Kuruma
Tatsuya Sawada