Title:
表面処理された銅微粒子及びその製造方法
Document Type and Number:
Japanese Patent JP6475541
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a surface treated copper fine particle excellent in oxidation resistance, capable of forming sintered film having good conductivity even with sintering at low temperature and capable of being manufactured with simple processes.SOLUTION: There is provided a surface treated copper fine particle excellent in oxidation resistance and having low temperature sinterability and having average particle diameter of 0.1 to 1.0 μm by mixing a copper fine particle obtained by conducting a chemical reduction method or a disproportionation reaction in a presence of a particle growth inhibitor with a solution containing a nitrogen containing organic article of 0.03 to 10 wt.% based on the copper fine particle after mixing with diluted sulfuric acid or without mixing with diluted sulfuric acid. There is provided a surface treated copper fine particle where the nitrogen containing organic article is a compound exemplified by the following formula.SELECTED DRAWING: None
Inventors:
Hideki Furusawa
Application Number:
JP2015070121A
Publication Date:
February 27, 2019
Filing Date:
March 30, 2015
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
B22F1/00; B22F1/02; B22F9/00; B22F9/20
Domestic Patent References:
| JP2015036441A | ||||
| JP2015036445A | ||||
| JP2006117959A |
Attorney, Agent or Firm:
Axis International Patent Business Corporation