Title:
SURFACE TREATMENT OF COPPER FOIL FOR PRINTED CIRCUIT
Document Type and Number:
Japanese Patent JP3103683
Kind Code:
B2
Abstract:
PURPOSE: To provide a surface treating method for improving the preservability (moisture resistance) and tarnish resistance of the lustrous surface of copper foil over a long period of time.
CONSTITUTION: The lustrous surface of copper foil for a printed circuit is subjected to Zn or Zn alloy plating and chromating, Zn or Zn alloy plating and electrolytic Zn-Cr treatment for forming a chromium oxidezinc and/or zinc oxide mixed coating film, or direct electrolytic Zn-Cr treatment for forming a chromium oxide-zinc and/or zinc oxide mixed coating film. The treated surface is then treated with a silane coupling agent such as epoxysilane, aminosilane, methacrylsilane or styrylsilane. The copper foil can be stored over a long period of time and treatment at a temp. above the conventional temp. is enabled.
Inventors:
Eiji Hino
Keisuke Yamanishi
Keisuke Yamanishi
Application Number:
JP25200792A
Publication Date:
October 30, 2000
Filing Date:
August 28, 1992
Export Citation:
Assignee:
Nikko Materials Co., Ltd.
International Classes:
C23C22/00; C23C22/24; C23C28/00; C25D7/06; C25D11/00; C25D11/38; H05K1/09; H05K3/38; (IPC1-7): C23C22/24; C23C22/00; C23C28/00; C25D7/06; C25D11/00; C25D11/38; H05K1/09
Domestic Patent References:
| JP2290490A | ||||
| JP4338694A | ||||
| JP5687676A | ||||
| JP5687695A |
Attorney, Agent or Firm:
Motohiro Kurauchi (1 outside)
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