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Title:
Surface treatment copper foil for printed wired boards, the copper-clad laminate sheet for printed wired boards, and a printed wired board
Document Type and Number:
Japanese Patent JP6182584
Kind Code:
B2
Abstract:
A surface-treated copper foil that is for a printed circuit board and that has a silane coupling agent layer on a surface on which roughened particles have been formed. The average height of the roughened particles on the silane-coupling-agent-layer surface is 0.05 μm or more but less than 0.5 μm, and the BET surface area ratio of the silane-coupling-agent-layer surface is 1.2 or higher.

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Inventors:
Takahiro Saito
Ken Minori
Application Number:
JP2015240006A
Publication Date:
August 16, 2017
Filing Date:
December 09, 2015
Export Citation:
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Assignee:
THE FURUKAW ELECTRIC CO.,LTD.
International Classes:
C23C26/00; B32B15/04; C25D7/06; H05K1/09; H05K3/38
Domestic Patent References:
JP62056677B1
JP2011162860A
Foreign References:
WO2011090175A1
Other References:
野呂 純二他,「比表面積,細孔分布,粒度分布測定」,ぶんせき,2009年 7月,2009年7月号,349-355頁
Attorney, Agent or Firm:
Toshizo Iida
Shuichi Akabane



 
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