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Title:
SURFACE TREATMENT OF COPPER PLATE
Document Type and Number:
Japanese Patent JPS6013870
Kind Code:
A
Abstract:

PURPOSE: To improve the adhesivity of a copper plate in water, and to maintain the adhesivity for a long period, by applying a cuprous oxide film to one surface of a copper plate or copper alloy plate by the chemical conversion treatment, and coating the oxide film surface with a phenolic resin or an epoxy resin primer.

CONSTITUTION: A cuprous oxide film 3 is formed to one surface of a copper plate or a copper alloy plate 1 by the chemical conversion treatment, and the treated surface is coated with the primer 2 composed of phenolic resin or epoxy resin. The primer-coated part 2 of the above copper plate 1 is bonded with the adhesive layer 4 to the insulation layer 5 of the copper plate 6 to prevent the adhesion of aquatic life at the part of a ship contacting water.


Inventors:
OOTA SHIYOUZOU
SAKANISHI AKIHIRO
Application Number:
JP12096283A
Publication Date:
January 24, 1985
Filing Date:
July 05, 1983
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
B05D7/14; C09J5/00; C09J5/02; C23C22/00; (IPC1-7): C09J5/02
Domestic Patent References:
JPS55116774A1980-09-08
JPS5356580A1978-05-23
JPS51151652A1976-12-27
Attorney, Agent or Firm:
Akira Uchida