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Title:
SYNTHETIC RESIN-MOLDED COMPONENT
Document Type and Number:
Japanese Patent JPH03186122
Kind Code:
A
Abstract:

PURPOSE: To make a synthetic resin-molding fungiproof as required, while the molding maintains its essential quality, by combining a synthetic resin molding of a material with a small factor of molding shrinkage with a molding of a different synthetic resin material containing an antifungal agent in such a manner as to cover the former molding throughout with the latter molding by adhesive joining.

CONSTITUTION: Each of blades 11 is formed of a molding 11a of filler-reinforced acrylonitrile-styrene copolymer (FR-AS) with a small factor of molding shrinkage and a molding 11b of filler-reinforced polypropylene (FR-PP) containing an antifungal agent, the latter molding 11b covering the former molding 11a throughout its surface. This constitution ensures in the molded product dimensional accuracy as required by virtue of a small molding shrinkage factor of the inner molding 11a and secures the product from attachment of hyphae, since the inner molding 11a is covered throughout with the molding 11b of FR-PP which has an excellent blooming property and contains the antifungal agent as an additive.


Inventors:
SATO TATSUO
Application Number:
JP32326989A
Publication Date:
August 14, 1991
Filing Date:
December 13, 1989
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
F04D29/02; B32B7/02; B32B27/18; F24F1/00; (IPC1-7): B32B7/02; B32B27/18; F04D29/02; F24F1/00
Attorney, Agent or Firm:
Norio Ohu



 
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