Title:
多数アーム研磨ツールを制御するためのシステムおよび方法
Document Type and Number:
Japanese Patent JP4675480
Kind Code:
B2
Abstract:
A system and method for controlling a polishing tool having multiple arms is provided. In accordance with one embodiment, a first removal rate for each arm based on a first wafer run is determined. A downforce adjustment input for each arm is then determined based on a process model, for the arms, which relates a removal rate for a given arm to downforce adjustments on each of the arms and using each first removal rate. The downforce adjustment input for each arm is provided to the polishing tool for polishing a subsequent run. In this manner, the method takes into account each arms removal rate dependency on the downforce adjustments for all of the arms. This can provide reduced removal rate variations between arms as well as between wafer lots and improve the characteristics of the ultimately formed semiconductor devices.
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Inventors:
Campbell, William Jay
Ledder, Christopher H
Miller, Michael El
Ledder, Christopher H
Miller, Michael El
Application Number:
JP2000557181A
Publication Date:
April 20, 2011
Filing Date:
December 18, 1998
Export Citation:
Assignee:
ADVANCED MICRO DEVICES INCORPORATED
International Classes:
B24B49/16; B24B37/04; H01L21/304; B25J9/16; G05B19/418
Domestic Patent References:
| JP6252113A | ||||
| JP8039422A | ||||
| JP9036070A | ||||
| JP9174430A | ||||
| JP9323261A | ||||
| JP10044028A | ||||
| JP10071562A |
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Hidehiko Ito
Yutaka Horii
Morishita Hachiro
Toshio Morita
Yoshihei Nakamura
Hidehiko Ito
Yutaka Horii
Morishita Hachiro