Title:
ＵＡＶの受動冷却のためのシステム、方法、および装置
Document Type and Number:
Japanese Patent JP7436204
Kind Code:
B2
Abstract:
An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.
More Like This:
| JP2006053914 | ELECTRONIC DEVICE |
| JPS57107062 | HEAT PIPE TYPE RADIATOR |
| JP5227672 | How to fix the heat pipe and heat sink |
Inventors:
Pen one
Don le
John Anderson
Qing Chuen Andrew Chu
Don le
John Anderson
Qing Chuen Andrew Chu
Application Number:
JP2019529854A
Publication Date:
February 21, 2024
Filing Date:
December 01, 2017
Export Citation:
Assignee:
Qualcomm, Inc.
International Classes:
H01L23/427; B64C39/02; B64D13/00; B64D47/00; F28D15/02; F28D15/04; H05K7/20
Domestic Patent References:
| JP2003283226A | ||||
| JP2006503436A | ||||
| JP2009204254A |
Foreign References:
| WO2016178008A1 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinpei Kuroda
Shinpei Kuroda