Title:
SYSTEMS AND METHODS FOR BONDING ELECTRONIC COMPONENTS ON SUBSTRATES WITH ROUGH SURFACES
Document Type and Number:
Japanese Patent JP2022045348
Kind Code:
A
Abstract:
To provide electronic devices, methods, and textile products, for bonding electronic components on textile substrates such as fabric with rough surfaces.SOLUTION: A method for bonding an electronic component (e.g., in a packaged die form) to a substrate with a rough surface and/or incorporating an electronic device in a substrate of an item (e.g., a piece of clothing) comprises: disposing an insulating adhesive on a substrate 1000; applying heat and pressure to the insulating adhesive to cause the adhesive to flow into at least one opening formed in the substrate; curing the insulating adhesive to form a pad 1402 that is partially embedded in the substrate; disposing a trace 1400 on a planar smooth surface of the pad; depositing an anisotropic conductive material 1500 on the pad so as to cover the trace; placing the electronic component on the pad so that an electrical coupling is formed between the electronic component 1700 and the trace; and bonding the electronic component to the substrate by curing the anisotropic conductive material.SELECTED DRAWING: Figure 18
Inventors:
MEI PING
Application Number:
JP2021144441A
Publication Date:
March 18, 2022
Filing Date:
September 06, 2021
Export Citation:
Assignee:
PALO ALTO RES CT INC
International Classes:
H01L21/60; H01R4/04; H01R11/01
Attorney, Agent or Firm:
Shinichiro Tanaka
Hiroyuki Suda
Fumiaki Otsuka
Takayoshi Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu
Hiroyuki Suda
Fumiaki Otsuka
Takayoshi Nishijima
Hiroshi Uesugi
Naoki Kondo
Takeo Nasu