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Title:
ダイナミックにモジュラー式の処理ユニットを提供するためのシステムおよび方法
Document Type and Number:
Japanese Patent JP5340982
Kind Code:
B2
Abstract:
Systems and methods for providing a modular processing unit. A modular processing unit is provided as a platform that is lightweight, compact, and is configured to be selectively used alone or oriented with one or more additional processing units in an enterprise. In some implementations, a modular processing unit includes a non-peripheral based encasement, a cooling process (e.g., a thermodynamic convection cooling process, a forced air cooling process, and/or a liquid cooling process), an optimized circuit board configuration, optimized processing and memory ratios, and a dynamic back plane that provides increased flexibility and support to peripherals and applications. The modular processing unit is customizable and may be employed in association with all types of computer enterprises. The platform allows for a plethora of modifications that may be made with minimal impact to the modular unit, thereby enhancing the usefulness of the platform across all type of application.

Inventors:
Sullivan Jason
Application Number:
JP2010030180A
Publication Date:
November 13, 2013
Filing Date:
February 15, 2010
Export Citation:
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Assignee:
Sullivan Jason
International Classes:
G06F1/16; G06F1/18; G06F1/20; H05K7/00; H05K7/10; G06C; H05K
Domestic Patent References:
JP60207398A
JP10056673A
JP10173349A
JP11065708A
JP2000232287A
JP2002099350A
JP2002258985A
JP8501165A
Attorney, Agent or Firm:
Sadao Kumakura
Disciple Maru Ken
Ino Sato



 
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