Title:
TAB TAPE WITH ADHESIVE, SEMICONDUCTOR CONNECTION BOARD AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3769853
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a TAB tape having excellent adhesiveness and insulating property, by causing an adhesive layer to contain a polyamide resin and a crosslinked phenol resin as essential components.
SOLUTION: A TAB tape with an adhesive is made of a laminate body having an adhesive layer 2 and a protective film layer provided on a flexible organic insulating film 1. The adhesive layer 2 contains a polyamide resin and at least one or more kinds of crosslinked phenol resins as essential components. Since it is important that the phenol resin is dissolved well with the polyamide resin, it should have a soluble percentage of 30% or higher. The number average molecular weight of the crosslinked phenol resin is set to 1000-200000. In addition, the mixing ratio of the crosslinked phenol resin and the polyamide resin is normally set to 5-50 parts by weight of the crosslinked phenol resin for 100 parts by weight of the polyamide resin. Thus, a TAP tape having excellent adhesiveness and insulating property may be provided.
Inventors:
Shoji Kikoshi
Yukitsuna Konishi
Taku Hatano
Yukitsuna Konishi
Taku Hatano
Application Number:
JP661797A
Publication Date:
April 26, 2006
Filing Date:
January 17, 1997
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
B32B27/00; H01L21/60; B32B27/34; B32B27/42; C09J7/02; C09J161/06; C09J177/00; (IPC1-7): H01L21/60; B32B27/00; B32B27/34; B32B27/42; C09J7/02; C09J7/02; C09J7/02; C09J7/02
Domestic Patent References:
| JP7258621A | ||||
| JP6322348A |