Title:
テープの貼付方法および貼付装置
Document Type and Number:
Japanese Patent JP4519413
Kind Code:
B2
Abstract:
Tapes 12, 12 ... are attached to a long support film 10, and the support film 10 is attached to frame member 18 at positions where the tape 12 to be stuck to an adherend 14 is included in a frame of the frame member 18. The support film 10 is pressed to stick the tape 12 to the adherend 14, and the support film 10 is released from the tape 12. The support film 10 is transferred and the above operations are repeated to stick the tapes 12, 12 ... to the respective adherends 14, 14 .... The tension to the tape 12 is diffused to the support film 10, and the frame member 18 blocks the tension of the support film 10 out of the frame. Accordingly, the tape 12 stuck to the adherend 14 has reduced residual stress and the adherend to which the tape has been stuck can be prevented from warpage.
Inventors:
Taketo Nakayama
Application Number:
JP2003105693A
Publication Date:
August 04, 2010
Filing Date:
April 09, 2003
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
B65H18/10; B65H37/04; B65H37/00; C09J5/00; H01L21/00
Domestic Patent References:
| JP6100842A | ||||
| JP10330022A | ||||
| JP2001156159A |
Foreign References:
| US5328546 |
Attorney, Agent or Firm:
Koji Makimura
Chihata Takahata
Toru Suzuki
Chihata Takahata
Toru Suzuki