TAPE CARRIER FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND THEIR MANUFACTURING METHOD

Title:

TAPE CARRIER FOR SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND THEIR MANUFACTURING METHOD

Document Type and Number:

Japanese Patent JP2001267377

Kind Code:

A

Abstract:

To provide a tape carrier that is not cracked and its manufacturing method, and a semiconductor device using the tape carrier, and to provide its manufacturing method.

An metal foil is formed on both surfaces of a flexible insulation tape 1, a protective film is formed, etching machining is applied, and the protective film is removed, thus forming a metal wiring layer 2 for mounting a semiconductor chip on one surface, exposing the insulation tape at a desired position on the other, the protecting the side of a metal wiring layer by the protective film made of resin. The exposed part of the insulation tape is subjected to etching for forming a via hole 3, and the protective film made of the resin is formed at the via hole 3 and at least at one part of the outer edge of the via hole 3 for carrying out the etching, thus eliminating the metal foil at the exposed part from the protection film for forming a copper ring 6, and removing the protective film that is formed on both surfaces of the insulation tape.

Inventors:

TSUNODA YOSHINORI
FURUKAWA YUTAKA
SODA YOSHIKI
JUSO HIROYUKI

Application Number:

JP2001000090A

Publication Date:

September 28, 2001

Filing Date:

January 04, 2001

Export Citation:

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Assignee:

SUMITOMO METAL MINING CO
SHARP KK

International Classes:

H01L23/12; H01L21/60; (IPC1-7): H01L21/60; H01L23/12

Attorney, Agent or Firm:

Kamoda Asao

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