TAPE CARRIER SUBSTRATE, AND SEMICONDUCTOR DEVICE

Title:

TAPE CARRIER SUBSTRATE, AND SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2009044126

Kind Code:

A

Abstract:

To provide a tape carrier substrate that can prevent a conductor wire from being broken at a boundary portion between the conductor wire on the tape carrier substrate and a slit formed in a folding portion of the tape carrier substrate even when a temperature is repeatedly changed inside the case body of a PDP.

First slits 106 and 107 are formed in the folding portions A and B of the tape carrier substrate 100 so that the width thereof located on an extensional portion side of the tape carrier substrate 100 is larger than that located on a central portion side of the tape carrier substrate 100. Stress resulting from bending of the tape carrier substrate is thus distributed, and the stress is prevented from concentrating at the boundary portion between the first slits 106 and 107 and the conductor wire 105b.

Inventors:

KOSAKA YUKIHIRO
NAKAMURA YOSHIFUMI

Application Number:

JP2008110806A

Publication Date:

February 26, 2009

Filing Date:

April 22, 2008

Export Citation:

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Assignee:

PANASONIC CORP

International Classes:

H01L21/60

Attorney, Agent or Firm:

Yoshihiro Morimoto
Toshiji Sasahara
Yohei Harada

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