To provide a tape which is used for fixing lead frames, has excellent electric reliability at high temperature and can be adhered at low temperature, to provide a lead frame using the tape for fixing the lead frames, and to provide a semiconductor device.
This double layer-structured adhesive tape prepared by disposing a 3 to 40 μm-thick adhesive layer on one side of a 10 to 125 μm support film is characterized in that the adhesive layer comprises (A) 100 pts.wt. of a heat-resistant thermoplastic resin having amide groups or imide groups, (B) 0.5 to 30 pts.wt. of an epoxy resin, and (C) 0.5 to 30 pts.wt. of a phenolic compound as an epoxy resin-curing agent, and has a glass transition temperature of 100 to 250°C, after thermally cured at 200°C for one hour. The lead frame with the tape for fixing the lead frames, and the semiconductor device using the same are disclosed.
TOMOTA NAOKO
MATSUURA SHUICHI
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