Title:
TAPE HAVING ADHESIVE FOR SURFACE MOUNT BGA-TYPE SEMICONDUCTOR DEVICE, AND COPPER CLAD LAMINATE, SEMICONDUCTOR CONNECTION BOARD AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP3750669
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a tape having an adhesive for a semiconductor device which achieves soldering-heat resisting and moisture resisting reliability, and a copper clad laminate, a semiconductor connection board and a semiconductor device using the same.
SOLUTION: The tape having the adhesive for the surface mount BGA-type semiconductor device is composed of a laminate having at least an adhesive layer on an organic insulation film wherein the water vapor permeability of the organic insulation film is ≥ 0.50g/m2/24h/mm, and the adhesive layer is composed of a thermosetting adhesive. There are also provided the copper clad laminate, the semiconductor connecting board and the semiconductor device using the same.
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Inventors:
Yasushi Sawamura
Miyoshi Yokura
Akihiro Kabashima
Miyoshi Yokura
Akihiro Kabashima
Application Number:
JP2003121014A
Publication Date:
March 01, 2006
Filing Date:
April 25, 2003
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
B32B27/00; C09J7/02; C09J161/06; C09J163/00; C09J177/00; H01L23/12; (IPC1-7): C09J7/02; B32B27/00; C09J161/06; C09J163/00; C09J177/00; H01L23/12
Domestic Patent References:
| JP9289229A | ||||
| JP9321093A |