To provide a tape for manufacturing a semiconductor, which has excellent balance between low-temperature adhesion and solubility into an alkaline solvent, and to provide a method for manufacturing a semiconductor device.

The tape 1 for manufacturing a semiconductor includes a first layer 11 including resin having a polyimide frame and a second layer 12 formed on the first layer 11 and including a pressure sensitive adhesive or adhesive, wherein the storage elastic modulus of the second layer 12 at 25°C is 105 Pa or more and 107 Pa or less, and the first layer 11 and the second layer 12 are soluble in an alkaline solvent (40°C) containing 28.2 wt.% of potassium hydroxide, 33.7 wt.% of monoethanolamine, and 38.1 wt.% of water.