Title:
テープ状接点材及びその製造方法
Document Type and Number:
Japanese Patent JP7153565
Kind Code:
B2
Abstract:
Provided is a tape-shaped contact member including a tape-shaped contact material. At least one wire-shaped brazing material is bonded to the tape-shaped contact material, at least one projection including the brazing material and protruding from a surface of the contact material is formed in a cross-sectional shape, a diffusion region containing a metal component forming the brazing material is formed along an interface with the brazing material inside the contact material, and the diffusion region has a thickness of 2 µm or more and 10 µm or less. A chip-shaped contact component can be obtained by cutting the tape-shaped contact member to an arbitrary length. The present contact component is useful as a constituent member for a switching electrical contact, and capable of adapting to height reduction of the electrical contact. The present invention can also contribute to reduction of occurrence of poor bonding.
Inventors:
Hiroshi Matsuo
Ryoe Wada
Ryoe Wada
Application Number:
JP2018557761A
Publication Date:
October 14, 2022
Filing Date:
December 18, 2017
Export Citation:
Assignee:
Tanaka Kikinzoku Kogyo Co., Ltd.
International Classes:
H01H1/06; H01H1/023; H01H11/04; H01H11/06
Domestic Patent References:
| JP3246832A | ||||
| JP647437A | ||||
| JP10163404A | ||||
| JP62271311A | ||||
| JP4279645B2 |
Foreign References:
| US5531962 |
Attorney, Agent or Firm:
Originate Patent Attorney Corporation
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