Title:
TAPE WITH ADHESIVE FOR SEMICONDUCTOR, AND METHOD FOR MANUFACTURING SUBSTRATE FOR CONNECTION FOR SEMICONDUCTOR USING THE SAME
Document Type and Number:
Japanese Patent JP2004356369
Kind Code:
A
Abstract:
To provide a tape with an adhesive for a semiconductor having an adhesive layer with excellent quality stability by realizing application to various usages and reducing a process cost, and to provide a substrate for connecting a semiconductor integrated circuit using the same and a semiconductor device.
The tape with the adhesive for the semiconductor includes the adhesive layer on the organic insulating film. The adhesive layer contains a resin cured at 20-50°C. A copper-clad laminate, the substrate for connecting the semiconductor integrated circuit, and the semiconductor device can be manufactured by using the tape with the adhesive for the semiconductor.
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Inventors:
KONISHI YUKITSUNA
NOURA TAKAHIRO
KIGOSHI SHOJI
NOURA TAKAHIRO
KIGOSHI SHOJI
Application Number:
JP2003152113A
Publication Date:
December 16, 2004
Filing Date:
May 29, 2003
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C09J7/02; C09J11/06; C09J161/06; C09J163/00; C09J171/10; C09J177/00; H01L21/60; (IPC1-7): H01L21/60; C09J7/02; C09J11/06; C09J161/06; C09J163/00; C09J171/10; C09J177/00
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