Title:
TAPE WITH ADHESIVE FOR TAB, SEMICONDUCTOR CONNECTING BOARD AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3644181
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a product superior in adhesion, chemicals resistance and insulation, by using an adhesive layer contg, a thermoplastic resin A and epoxy resin B contg. an epoxy resin b shown by specified formula as a necessary component.
SOLUTION: A tape with adhesive for TAB is composed of a laminate of an adhesive layer and protective film layer on a flexible org. insulation film. The adhesive layer contains a thermoplastic resin A and an epoxy resin B which contains an epoxy resin shown by the formula as a necessary component, wherein R1-R8 are H atoms and c1-c4 are lower alkyl groups or halogen atoms. The thermoplastic resin uses e.g. a polyamide resin and the epoxy resin used 4,4'-bis(2,3-epoxypropoxy)-3,3',5,5'-tetramethylbiphenyl.
Inventors:
Yasushi Sawamura
Taku Hatano
Shoji Kikoshi
Taku Hatano
Shoji Kikoshi
Application Number:
JP3479597A
Publication Date:
April 27, 2005
Filing Date:
February 19, 1997
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
B32B7/12; C09J7/02; C09J163/00; C09J177/00; C09J177/06; H01L21/60; (IPC1-7): H01L21/60; B32B7/12; C09J7/02; C09J163/00; C09J177/06
Domestic Patent References:
| JP6338681A | ||||
| JP62095373A |