Title:
TAPE WITH TAB ADHESIVE AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3396989
Kind Code:
B2
Abstract:
PURPOSE: To realize good bonding property and chemical resistance by incorporating naphthol compound and polyamide resin to an adhesive layer as an essential element.
CONSTITUTION: The title tape is constituted of a lamination body having an adhesive layer 2 and a protection film layer on a flexible organic insulating film 1 and naphthol compound and polyamide resin are incorporated to the adhesive layer 2 as an essential element. For example, the adhesive layer 2 contains epoxy resin. Naphthol compound has a plurality of OH groups bonded to naphthalene skeleton in one molecule and polyamide resin contains 36C dicarboxylic acid as an essential element. Compounding ratio of naphthol compound and polyamide resin is 5 to 100 pts.wt., desirably, 30 to 80 pts.wt. of naphthol compound to 100 pts.wt. of polyamide resin. An addition amount of epoxy resin is 20 to 100 pts.wt., desirably, 40 to 70 pts.wt. of epoxy resin to 100 pts.wt. of polyamide resin.
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Inventors:
Yasunari Sugiura
Masaji Kigoshi
Taku Hatano
Masaji Kigoshi
Taku Hatano
Application Number:
JP6407895A
Publication Date:
April 14, 2003
Filing Date:
March 23, 1995
Export Citation:
Assignee:
Toray Industries, Inc.
International Classes:
C09J7/02; C09J161/06; C09J161/10; C09J163/00; C09J177/00; H01L21/60; (IPC1-7): H01L21/60; C09J7/02; C09J161/10; C09J163/00; C09J177/00
Domestic Patent References:
| JP7258621A | ||||
| JP8181174A |