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Title:
TAPING APPARATUS FOR ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2007069946
Kind Code:
A
Abstract:

To provide a taping apparatus for an electronic component, the taping apparatus being designed such that trouble caused by sealing tape is prevented by exerting control so that the tension of the sealing tape used for taping the electronic component is kept constant.

The taping apparatus includes a conveying mechanism 1 that conveys carrier tape CT in which a plurality of pockets H are formed, a holding mechanism 2 that inserts electronic components P into the pockets H, a sealing tape unwinding mechanism 3 from which the sealing tape ST is fed out, a thermocompression bonding mechanism 5 that bonds the sealing tape ST under heat and pressure to the carrier cape CT with the electronic components P inserted in the pockets H, and thereby seals the pockets H, and a sealing tape tension control mechanism 4 that controls the tension of the sealing tape.


Inventors:
OTSUKA TAKAHIKO
Application Number:
JP2005258559A
Publication Date:
March 22, 2007
Filing Date:
September 06, 2005
Export Citation:
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Assignee:
UENO SEIKI KK
International Classes:
B65B15/04; B65B41/16; B65H23/182
Domestic Patent References:
JP2001018920A2001-01-23
JPH10101020A1998-04-21
JP2004001870A2004-01-08
JP2002234648A2002-08-23
JPH03227866A1991-10-08
Attorney, Agent or Firm:
Kiuchi Mitsuharu



 
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