PURPOSE: To tape semiconductor devices without mistakes at a high speed, by providing a pick-and-place unit by which a semiconductor device positioned on a semiconductor table is transferred to a required position of a carrier tape and also another semiconductor device on a movable table is transferred to a vacant semiconductor table respectively.

CONSTITUTION: A semiconductor device A which is placed on a movable table 2 by descent of a pick-and-place unit 4 is placed on a semiconductor device table 2 by a vacuum cluck 29. The semiconductor device A centered by four centering claws 21, is fixed by suction and raised by another vacuum chuck 30. The former device A sucked by the vacuum chuck 29 is transferred on to semiconductor device table 3 and the latter device A sucked by the vacuum chuck 30 is transferred on a carrier table respectively. Then, the initial state returns after the transfer. The above operation is repeated for every piece of semiconductor device fed from a tube 1 and the positioned semiconductor device is taped up at a required position of a carrier tape.