Title:
テーピング装置及びテーピング方法
Document Type and Number:
Japanese Patent JP6831573
Kind Code:
B2
Abstract:
Provided are: a taping device that can reliably perform taping on wires of different diameters, that allows effective use of insulation tape, that can uniformly attach insulation tape on the circumferential face of a wire, and that allows for taping in a step that follows a winding step and is separate from the winding step; and a taping method. This taping device for attaching insulation tape on the circumferential face of a wire comprises: an accommodation recess that has an opening opened in one direction wherein the gap of the opening is larger than the diameter of the wire and that allows the wire on which the insulation tape is attached on a portion of the circumferential face thereof to be accommodated therein via the opening; and a plurality of air injection ports that open to the interior of the accommodation recess. The plurality of air injection ports is provided so that the insulation tape is pressed for attachment onto the circumferential face of the wire by the pressure of the injected air.
Inventors:
Shinro Miyawaki
Odagiri Kanna
Shunsuke Murata
Odagiri Kanna
Shunsuke Murata
Application Number:
JP2017163014A
Publication Date:
February 17, 2021
Filing Date:
August 28, 2017
Export Citation:
Assignee:
Odawara Engineering Co., Ltd.
International Classes:
B65H81/06; H01B13/10
Domestic Patent References:
| JP5516858A | ||||
| JP545102B1 | ||||
| JP504269B1 | ||||
| JP757840A |
Attorney, Agent or Firm:
Yoshiharu Yoshida
Mayuko Horikoshi
Mayuko Horikoshi