Title:
テーピング装置
Document Type and Number:
Japanese Patent JP7271793
Kind Code:
B2
Abstract:
The present invention absorbs slack in a tape (7) and improves the quality of taping with respect to a taped body (9). The present invention comprises a base (1), guide rings (2a, 2b) that are attached to the base (1) and are provided with roller guides (4) configured to be capable of rotating, and a timing pulley (3) that rotates along the outer periphery of the guide rings (2a, 2b) and is provided with a tension mechanism (10) for imparting tension to a tape (7) wound on a taped body (9) positioned at the center of rotation. The tension mechanism (10) and the roller guides (4) periodically impart tension to the tape (7).
Inventors:
Hiroki Amemori
Shinichi Ohe
Junji Nishihara
Shinichi Ohe
Junji Nishihara
Application Number:
JP2022530416A
Publication Date:
May 11, 2023
Filing Date:
June 10, 2020
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
B65H81/06; B65B41/12
Domestic Patent References:
| JP56108669A | ||||
| JP56165668A | ||||
| JP20016461A | ||||
| JP201146461A |
Attorney, Agent or Firm:
Parumo Patent Attorneys Office