PURPOSE: To make the thickness of a sealing resin on the surface of a semiconductor substrate uniform and, at the same time, to uniformly fill up the spaces of in device hole on both sides of the substrate with the sealing resin by making the clearance between the wall of the device hole and substrate on the side on which inner leads are connected to the substrate at longer intervals.

CONSTITUTION: The intervals W1 of first-side inner leads 31 connected to the first side of a semiconductor substrate 2 mounted in the device hole 5 of a carrier tape 4 are made longer than those W2 of inner leads 31 connected to the second side of the substrate 2. In such a tape carrier package semiconductor device, the interval L1 between the first side of the hole 5 facing the first side of the substrate 2 and the first side of the substrate 2 is made shorter than that L2 between the second side of the hole 5 facing the second side of the substrate 2 and the second side of the substrate 2.