TEFLON FILLED RESINOID DICING BLADE FOR PRODUCING SILICON DIE MODULE

Title:

TEFLON FILLED RESINOID DICING BLADE FOR PRODUCING SILICON DIE MODULE

Document Type and Number:

Japanese Patent JPH08224730

Kind Code:

A

Abstract:

To obtain a blade capable of reducing nozzle chipping by immersing the dicing blade of a silicon die module like an ink jet printing head in a 'Teflon(R)' (registered trademark) soln. and degassing the blade in a degassing chamber.

When a 'Teflon(R)' filled resinoid deciding blade 10 is produced, a 'Teflon(R)' soln. containing fluorinate as a solvent and soluble 'Teflon AF(R)' (registered trademark) having 2 wt.% of 'Teflon AF(R)' are prepared. A plurality of resinoid dicing blades having exposure holes and about 20 vol.% of porosity are immersed in a 'Teflon(R)' soln. to be transferred to a vacuum chamber in an immersed state and substantially all of air is removed from the exposure holes of the blades by evacuating the vacuum chamber. Thereafter, the solvent is evaporated from the 'Teflon(R)' soln. in the atmosphere in order to fill the exposure holes of the blades with 'Teflon(R)'.

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Inventors:

ROBAATO EMU HOWAITO
ROORENSU EICHI HAAKO
ROBAATO PII ARUTABUERA

Application Number:

JP28119495A

Publication Date:

September 03, 1996

Filing Date:

October 30, 1995

Export Citation:

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Assignee:

XEROX CORP

International Classes:

B41J2/16; B05D1/18; B05D3/04; B23D61/10; B23D65/00; B24D3/00; B24D3/28; B24D3/34; B24D5/12; B28D5/02; H01L21/301; (IPC1-7): B28D5/02; B24D3/00; B24D3/28; B41J2/16; H01L21/301

Attorney, Agent or Firm:

Minoru Nakamura (6 outside)

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