To provide a temperature compensated oscillator small in projection area by providing a circuit board with one or plural through-hole for charging a resin, thereby charging the resin from through-holes without the need of a resin receiver.

Semiconductor chips 17 and 41 and a passive element are arranged at a part 18 excluding the projection part of the circuit board 13 which is a clearance formed by a surface mounted type crystal vibrator 11 and the projection part 16. The chips 17 and 41 are connected to the board 13 by a solder bump 22 and mounted to the board 13. Thereafter, the resin 23 is filled from the lower surface of the board 13 to the clearance of the chips 17 and 41 and the board 13 by using a syringe. At the time, the resin 23 is charged from the through-hole 15 provided right below the chip 17 mounted to the part 18 excluding the projection part of the board 13 until the side face of the chips 17 and 41 and the passive element is buried. The through-hole 15 is positioned at the almost center of the part 18 excluding the projection part of the board 13.