To provide a temperature compensation oscillator that inspects a connection state of a semiconductor integrated circuit through electric continuity and to provide its inspection method.

The temperature compensation oscillator consists of a surface mounted crystal vibrator 11, a printed circuit board 13, semiconductor chips 19, 21 that are circuit components and a passive component 23. A projection 15 of the printed circuit board 13 is provided with a 1st ground potential electrode 25 and a 2nd ground potential electrode 27 for the connection to the surface mounted crystal vibrator 11. The two electrode connect to a wiring pattern of the printed circuit board 13 in a way of a short-circuit with internal wiring of the semiconductor chips 19, 21. The connection yield between the printed circuit board 13 and the semiconductor chips 19, 21 can be enhanced by inspecting the connection state of the semiconductor chips 19, 21 connecting to the printed circuit board 13 by means of flip-chip mount through the measurement of electric continuity between the 1st ground potential electrode 25 and the 2nd ground potential electrode 27.