Title:
TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING
Document Type and Number:
Japanese Patent JP2023126746
Kind Code:
A
Abstract:
To provide a technology related to temperature control during chemical mechanical polishing.SOLUTION: A chemical mechanical polishing apparatus 20 includes: a platen 24 for holding a polishing pad 30; a carrier head 70 for holding a substrate against a polishing surface of the polishing pad 30 during a polishing process; a dispenser for supplying a polishing liquid to the polishing surface; and a temperature control system 120 including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body 110 supports a thermal control module 120 positioned over the polishing pad 30.SELECTED DRAWING: Figure 2
Inventors:
HARI SOUNDARARAJAN
CHANG SHOU-SUNG
WU HAOSHENG
TANG JIANSHE
OH JEONGHOON
RAJEEV BAJAJ
ANDREW SIORDIA
CHANG SHOU-SUNG
WU HAOSHENG
TANG JIANSHE
OH JEONGHOON
RAJEEV BAJAJ
ANDREW SIORDIA
Application Number:
JP2023085900A
Publication Date:
September 12, 2023
Filing Date:
May 25, 2023
Export Citation:
Assignee:
APPLIED MATERIALS INC
International Classes:
B24B37/015; B24B37/30; B24B49/14; B24B57/02; H01L21/304
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation