移動検出デバイスの温度依存較正

Japanese Patent JP7426982

B2

An electronics system comprising a board (12) that includes: a structural material (22); a thermal conduit on the structural material (22), the thermal conduit having a thermal conductivity that is higher than a thermal conductivity of the structural material and having a first region (46), a second region (48), and a connecting portion (40, 42) connecting the first region to the second region; a thermal interface (52) on the structural material (22), the thermal interface having a thermal heat transfer capacity that is higher than the thermal heat transfer capacity of the structural material (22) and being attached to the first region (38) of the thermal conduit; an electronics device (14) mounted to the board (12) at the second region (48) of the thermal conduit, the thermal conduit forming a thermal path between the surface of the thermal interface (52) and the electronics device (14); and a movement detection device (70, 72) in the electronics device (14); a system storage (18); and calibration data on the system storage (18), the calibration data including a first temperature of the movement detection device (70, 72); a first output from the movement detection device (70, 72) recorded against the first temperature; and a second temperature of the movement detection device (70, 72) that is different than the first temperature; and a second output from the movement detection device (70, 72) recorded against the second temperature.

Allen, Cuthbert Martindale
Abbott, Michael Derek
Levinsky, Igor
johnson, jeffrey
Goldstein, Simon
Schuelke, Aaron Mark

JP2021503762A

February 02, 2024

July 23, 2019

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Magic Leap,Inc.

G01P21/00

JP2017015697A
JP2012235036A
JP2011257203A
JP336974U

US20180095481

Shusaku Yamamoto
Natsuki Morishita
Takatoshi Iida
Daisuke Ishikawa
Kensaku Yamamoto

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