Title:
TEMPERATURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP3541194
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a temperature-sensitive adhesive composition containing a crystalline polymer.
SOLUTION: This temperature-sensitive adhesive composition comprises a side chain-crystalline polymer. The side chain-crystalline polymer comprises (a) side chain-crystalline recurring units derived from an acrylate or methacrylate ester and (b) side chain-noncrystalline recurring units derived from an acrylate or methacrylate ester, has almost no adhesiveness below the melt starting temperature T0, varies to have adhesiveness by heating from a temperature below T0 to a temperature above the peak melting temperature Tm and varies to lose adhesiveness by cooling from a temperature above Tm to a temperature below T0. The composition is applied to immobilize a main body element on a substrate at the temperature above Tm and then peel the main body element from the substrate by cooling below T0.
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Inventors:
Rayev. Stewart
Edward emill schmidt
Edward emill schmidt
Application Number:
JP2002061226A
Publication Date:
July 07, 2004
Filing Date:
April 24, 1990
Export Citation:
Assignee:
Nitta Corporation
International Classes:
A61K9/70; A61F13/02; A61L15/58; B32B7/12; C09J5/06; C09J7/35; C09J9/00; C09J123/02; C09J133/00; C09J133/04; C09J133/06; C09J133/08; C09J151/00; C09J155/00; C09J201/00; B05B15/04; (IPC1-7): C09J133/00; C09J7/02; C09J9/00; C09J151/00; C09J155/00
Domestic Patent References:
JP58154778A | ||||
JP50151290A | ||||
JP51030838A | ||||
JP51006234A | ||||
JP2110183A | ||||
JP4507425A | ||||
JP3410692B2 | ||||
JP50015256B1 | ||||
JP53121038A | ||||
JP60500992A |
Foreign References:
US3635754 |
Attorney, Agent or Firm:
Hidesaku Yamamoto