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Title:
TEMPERATURE SENSOR ASSEMBLY
Document Type and Number:
Japanese Patent JP2008128621
Kind Code:
A
Abstract:

To provide an inexpensive temperature sensor assembly with superior temperature followability.

The temperature sensor assembly 1 is provided with a thermistor 2, and a thermosensitive tube 3. The thermistor 2 changes a resistance value in response to temperature change. The thermosensitive tube 3 houses the thermistor 2 and it is installed on a temperature detection object. The thermosensitive tube 3 has a securing part 5 protruding from a first wall surface 4a of a housing chamber 4 housing the thermistor 2, and the thermistor 2 is held between the securing part 5 and a second wall surface 4b facing the securing part 5. Since the thermistor 2 is held just by the thermosensitive tube 3 in the temperature sensor assembly 1, there is no need for another member for attaching the thermistor 2, a heat capacity of the temperature sensor assembly 1 becomes small, and the temperature followability is improved.


Inventors:
NISHI KEIJI
Application Number:
JP2006317318A
Publication Date:
June 05, 2008
Filing Date:
November 24, 2006
Export Citation:
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Assignee:
DAIKIN IND LTD
International Classes:
F25B49/02; F24F11/02
Domestic Patent References:
JPS62167066A1987-07-23
JPS6169786A1986-04-10
Attorney, Agent or Firm:
Yukio Ono
Hidetada Kato
Yamashita
Hiroharu Kitahara