Title:
TEMPERATURE SENSOR
Document Type and Number:
Japanese Patent JPS5679485
Kind Code:
A
Abstract:
1. A temperature sensor consisting of a semiconductor body (1) which, on the one hand, is provided at its upper side with an insulating layer (2) in which there is arranged a window (5) through which the semiconductor body (1) is provided with a metal contact (3), and which, on the other hand, is provided on its surface facing away from the upper side with a metal coating (7), so that a spreading resistance is formed in the semiconductor body (1) between the metal contact (3) and the metal coating (7), characterised in that at least one further window (6) is additionally arranged on the upper side, through which window at least one further metal contact (4), which forms a further spreading resistance in the semiconductor body (1) with the metal coating (7), contacts the semiconductor body (1) ; that the thickness (d) of the semiconductor body (1) is substantially smaller than the distance (I) between the centre points of the windows (5, 6) ; and that the metal coating (7) serves as a connecting line between the spreading resistances in order to render the spreading resistance between the metal contacts (3, 4) and the metal coating (7) independent of the current direction or symmetrical.
Inventors:
PEETAA HORA
GIRUBERUTO TOMASHI
GIRUBERUTO TOMASHI
Application Number:
JP15130080A
Publication Date:
June 30, 1981
Filing Date:
October 28, 1980
Export Citation:
Assignee:
SIEMENS AG
International Classes:
H01C7/04; G01K7/01; G01K7/16; G01K7/22; H01L35/00; (IPC1-7): G01K7/22; H01C7/04; H01L35/00