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Title:
TEMPERATURE SYSTEM EXPANSION VALVE AND ITS SETUP METHOD
Document Type and Number:
Japanese Patent JPH11270929
Kind Code:
A
Abstract:

To provide a temperature system expansion valve in which the pressure resistance of a welded part where an upper lid and a lower lid are joined with each other is high and besides which is high in productivity and reliability, and its setup method.

A temperature system expansion valve, where an upper lid 12 is laid through a diaphragm 11 on a lower lid 8 fixed to the valve body 1 and the junction end of each member is welded to the other, is provided with a cylindrical part 10 extended upward around the lower lid 8, and is provided with a cylindrical part 9 to engage with the inside periphery of the cylindrical part 10 of the lower lid 8, around the diaphragm 11, and also is provided with a circumferential part 29 to engage with the inside periphery of the diaphragm 11, around the upper lid 12, and an upward junction end, which comes into being at engagement of each cylindrical part among the upper lid 12, the diaphragm 11 and the lower lid 8, is made a welding part 13.


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Inventors:
IKEDA NORIUCHI
OKAMURA SHIGEO
KANEKO MORIO
Application Number:
JP9391698A
Publication Date:
October 05, 1999
Filing Date:
March 24, 1998
Export Citation:
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Assignee:
SAGINOMIYA SEISAKUSHO INC
International Classes:
F25B41/06; (IPC1-7): F25B41/06
Domestic Patent References:
JPH0835746A1996-02-06
JPS6082173U1985-06-07
JPS61153875U1986-09-24
JPS60156373U1985-10-18
JPS631156Y21988-01-12
JPS4921702Y11974-06-11
Attorney, Agent or Firm:
Koichi Kusano