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Title:
TEMPLATE FOR SEMICONDUCTOR IMPRINT
Document Type and Number:
Japanese Patent JP2013033878
Kind Code:
A
Abstract:

To provide a template that does not require a complicated suction mechanism for an imprint device by preventing resist from oozing out to an adjacent field and making a gap between shots.

There is provided a template for semiconductor imprint such that a template having an uneven pattern formed is pressed against a photocuring material and the uneven pattern is transferred by optically curing the photocuring material, and the template is provided with an auxiliary pattern which assists the photocuring material in making a wet spread uniformly along a field edge of the template by capillarity, and absorbs an excessive photocuring material, the auxiliary pattern being a line pattern comprising a plurality of segmented recessed parts provided at a periphery of the field edge in parallel with the field edge.


Inventors:
ICHIMURA KOJI
Application Number:
JP2011169829A
Publication Date:
February 14, 2013
Filing Date:
August 03, 2011
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01L21/027; B29C59/02
Domestic Patent References:
JP2011521438A2011-07-21
JP2011023660A2011-02-03
JP2008091782A2008-04-17
JP2007194601A2007-08-02
Attorney, Agent or Firm:
Satoshi Kanayama
Keiko Fukamachi
Hideo Ito
Hiromi Fujimasu
Naoki Goto
Yusuke Ito



 
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