Title:
Temporary adhesives for joining an element
Document Type and Number:
Japanese Patent JP6077708
Kind Code:
B2
Abstract:
A rosin composition includes a gum rosin, an emulsifier, a randomizing additive and a bonding agent. This rosin composition may be used as a temporary or permanent adhesive for the soldering of components. The rosin composition may be temporary as it is easily removed from a surface without damaging the surface.
Inventors:
Luke M. Fraetie
Rundle E. Na
Tiffany Tee. Rundle
Rundle E. Na
Tiffany Tee. Rundle
Application Number:
JP2016500166A
Publication Date:
February 08, 2017
Filing Date:
January 15, 2014
Export Citation:
Assignee:
RAYTHEON COMPANY
International Classes:
C09J193/04; C09J11/06; C09J129/04; C09J131/04; C09J201/02; H05K3/34
Domestic Patent References:
| JP9221644A | ||||
| JP52074660A | ||||
| JP2000309771A | ||||
| JP2010280878A |
Foreign References:
| KR1020060102197A | ||||
| CN102492376A | ||||
| CN102676066A | ||||
| CN1635040A | ||||
| CN102399498A |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Hideo Katsumata
Takashi Ishida
Tetsuji Koga
Kazuhiro Nakamura
Hideo Katsumata