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Patent Searching and Data


Title:
TERMINAL FOR CERAMIC LAYER PACKAGE
Document Type and Number:
Japanese Patent JPS60218861
Kind Code:
A
Abstract:

PURPOSE: To obtain a terminal characterized by easy, reliable attachment, easy production and excellent conductivity, by applying silver solder in the main body of a tubular terminal, and coating the outer surface part with a film having excellent conductivity.

CONSTITUTION: A terminal main body 11 is formed in a tubular shape by a sealing material such as Cobal, alloy of iron, nickel and cobalt, alloy of iron, nickel and chromium, alloy of iron and nickel and alloy of iron and chromium. A silver solder spigot 12 is inputted in the terminal main body 11. A wire material is formed by drawing. The body is cut and a film 13 is formed. Thus the terminal is completed. Or, the film 13 is formed on the wire material and thereafter the material is cut. Thus the terminal is completed. The film 13 is formed by the plating of one of tin, zinc, aluminum, silver or gold, copper alloy, silver alloy and the like. When the terminal is attached to a ceramic layer package, the terminal can be fused and fixed without using a silver solder chip.


Inventors:
FUJIYOSHI KATSUSATO
Application Number:
JP7395084A
Publication Date:
November 01, 1985
Filing Date:
April 14, 1984
Export Citation:
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Assignee:
FUJIYOSHI KATSUSATO
International Classes:
H01R4/02; H01L23/49; H01L23/498; H01L23/50; (IPC1-7): H01L23/48; H01R4/02
Domestic Patent References:
JPS5431871A1979-03-08
JPS3613740Y1
Attorney, Agent or Firm:
Mitsuyasu Miura