Title:
TERMINAL CONNECTION OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JPH01115102
Kind Code:
A
Abstract:
PURPOSE:To execute terminal connection in a short time by fitting a heater chip on the end-section piece side of a lead terminal group composed of an oxygen-free copper plate and pressure-welding and connecting the lead terminal group to an Au electrode section formed onto a ceramic substrate at a specific heating temperature. CONSTITUTION:Beltlike metallic pieces 6a, 6b shaped by punching lead terminals 5a-5c are composed of oxygen-free copper, and only sections A are plated with solder. A heater chip 8a consisting of molybdenum, etc., is fitted to the top face of a lead-terminal connecting section 7c, and the heater chip 8a is conducted and a heat generating phenomenon is generated. The lead terminal connecting section 7c is connected to an Au electrode section 2c for a ceramic substrate 1a by pressing the heater chip 8a. The temperature of the heater chip 8a is elevated at 500 deg.C or more. Accordingly, terminal connection having stability on connection can be acquired in a short time.
Inventors:
UNO KATSUYUKI
Application Number:
JP27269887A
Publication Date:
May 08, 1989
Filing Date:
October 28, 1987
Export Citation:
Assignee:
NEC CORP
International Classes:
H01C10/32; H01C13/00; H01C17/28; (IPC1-7): H01C10/32; H01C13/00; H01C17/28
Attorney, Agent or Firm:
Sugano Naka