PURPOSE: To obtain a terminal device having high bonding strength and excellent durability by mounting a conductor layer at a lead through a pad material.

CONSTITUTION: A conductor circuit (electric conductor layer) 12 is formed on a board 12, and the board 12 has many terminals 12a formed along the edge of the board. The ends 14a of leads 14 are bonded to the terminals 12a through pad materials 16 with rectangular copper thin plates as the material 16 by soldering. The material 16 has a sufficiently wider surface area than the bonding area for bonding the ends 14a to the materials 16. The leads 14 terminal-processed with the materials 16 are previously soldered by using high temperature solder.