To provide a test device that is in contact with both front and rear faces of a wafer.

A test device for testing an electronic device formed on a wafer includes: a stage having an elastic layer on which the wafer is placed, and a plurality of protrusions provided on the elastic layer and electrically connected to an electrode pad formed on the rear face of the wafer; and a fixing member for fixing the wafer on the stage. The test device is provided in which the plurality of protrusions are made to sink into the elastic layer and faces around the plurality of the protrusions come into contact with the rear face of the wafer when the wafer is fixed by the fixing member.