Title:
試験装置
Document Type and Number:
Japanese Patent JP4369595
Kind Code:
B2
Abstract:
A device is described for testing the force to shear a deposit of solder or gold from a substrate, these deposits having a diameter in the range 50-100 mum and being for the bonding of electrical conductors. A shear tool has a semi-cylindrical cavity which closely approximates to the mean diameter of a range of substrates. This tool is adapted to re-shape substrates for a better fit, re-shaping occurring over 30% or less of the circumference of a deposit, and to a depth of 10% or less of the diameter of the substrate.
Inventors:
Robert Sykes
Application Number:
JP2000135142A
Publication Date:
November 25, 2009
Filing Date:
May 08, 2000
Export Citation:
Assignee:
Daige Precision Industries Limited
International Classes:
G01N19/04; G01R31/26; G01N3/00; G01N3/24; G01N33/20; G01N3/02
Domestic Patent References:
| JP10074787A | ||||
| JP5264437A | ||||
| JP11002576A | ||||
| JP6252220A | ||||
| JP11288986A | ||||
| JP10150078A |
Attorney, Agent or Firm:
Tsutomu Toyama
Hidemi Matsukura
Yutaka Nagata
Yoshiyuki Kawaguchi
Hidemi Matsukura
Yutaka Nagata
Yoshiyuki Kawaguchi