Title:
試験装置
Document Type and Number:
Japanese Patent JP4386487
Kind Code:
B2
Abstract:
Apparatus for testing electrical bonds of a semiconductor device includes a cantilever arm (14a) with a test head (16) mounted thereon. The test head (16) is biased by the arm (14a) against a base plate (11), but can be moved away from the base plate (11) by an air bearing (22) to ensure substantially frictionless initial positioning. Sensing means (32;34) for sensing contact with a semiconductor substrate are also disclosed.
Inventors:
Robert Sykes
Application Number:
JP33166298A
Publication Date:
December 16, 2009
Filing Date:
November 20, 1998
Export Citation:
Assignee:
Daige Precision Industries Limited
International Classes:
G01R31/28; G01R1/067; H01L21/66; G01R31/26
Domestic Patent References:
| JP2140480U | ||||
| JP6002696U | ||||
| JP2124572U | ||||
| JP61026156U | ||||
| JP10150078A | ||||
| JP8201426A | ||||
| JP54091873U | ||||
| JP4074976A |
Attorney, Agent or Firm:
Tsutomu Toyama
Hidemi Matsukura
Yutaka Nagata
Yoshiyuki Kawaguchi
Hidemi Matsukura
Yutaka Nagata
Yoshiyuki Kawaguchi