Title:
感熱性粘着剤及び感熱性粘着材料
Document Type and Number:
Japanese Patent JP4755435
Kind Code:
B2
Abstract:
To provide a heat-sensitive adhesive having strong adhesive strength to a rough surface adherend such as corrugated cardboard, and a polyolefin wrap film, hardly causing deterioration of the adhesive strength with time, capable of being thermally activated with a low energy, and having good blocking resistance; and to provide a heat-sensitive adhesive material.
The heat-sensitive adhesive contains at least a thermoplastic resin and a hot-melt material which contains at least one kind of a compound represented by structural formula (I) and a compound represented by general formula (II), (In the formulas, R
COPYRIGHT: (C)2006,JPO&NCIPI
Inventors:
Hiroshi Goto
Taketo Yamaguchi
Kunio Hayakawa
Taketo Yamaguchi
Kunio Hayakawa
Application Number:
JP2005078509A
Publication Date:
August 24, 2011
Filing Date:
March 18, 2005
Export Citation:
Assignee:
株式会社リコー
International Classes:
C09J201/00; B41J2/01; B41M5/00; B41M5/28; B41M5/30; B41M5/382; B41M5/40; B41M5/50; B41M5/52; C09J7/02; C09J11/06; G03G7/00
Domestic Patent References:
| JP2001081420A | ||||
| JP2002038122A | ||||
| JP2002146303A |
Attorney, Agent or Firm:
Koichi Hirota